| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor element inspection substrate capable of inspecting a semiconductor element accurately and effectively; and also to provide a manufacturing method of the semiconductor element inspection substrate capable of definitely manufacturing the same. SOLUTION: This semiconductor element inspection substrate 1 includes: a substrate body 2 having the surface 3 and the back 4; a projection part 5 projecting from the center part of the surface 3 of the substrate body 2 and presenting a quadrangular prism having a surface connection terminal 8 formed on the top face 7; a pair of recessed parts 10 formed on the surface 3 of the substrate body 2 and on the periphery of the projection part 5; a plurality of pads 14 formed on the bottom surface 12 of each recessed part 10; and a back connection terminal 9 formed on the back 4 of the substrate body 2 and conducting to at least either of the surface connection terminal 8 and the pads 14. COPYRIGHT: (C)2007,JPO&INPIT
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