| 摘要 |
A method for manufacturing a printed circuit board is provided to simplify a process by filling a through hole with a conductive material and sintering the conductive material with a heat. A method for manufacturing a printed circuit board includes the steps of: placing a copper layer laminate plate, on which a copper layer is formed, on at least one side of an insulation layer(S100); forming a through hole, penetrating the copper layer laminate plate, on the copper layer laminate plate(S200); filling the through hole with a conductive material(S300); applying a predetermined heat to the copper layer laminate plate filled with the conductive material for sintering the conductive material(S400); and forming a circuit pattern by a copper layer(S600), wherein the circuit pattern formed on at least one side of an insulation layer is connected electrically via the through hole.
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