| 摘要 |
An aperture changing apparatus of a wafer laser sawing apparatus is provided to remarkably improve work efficiency by rapidly and precisely changing an aperture changing apparatus into an aperture suitable for a condition by a simple manipulation of an operator whenever it is necessary. A driving axis(21) has a screw or a screw part along the outer circumferential surface of a laser sawing apparatus, capable of rotating horizontally. A driving unit(22) is connected to one end of the driving axis in a manner that can be driven to drive the driving axis. A transfer member(23) penetrates the center of the section part of an aperture changing apparatus. A driving axis assembly hole(23a) having a screw or a screw part is included along the inner circumferential surface of the transfer member. The transfer member is transferred in the longitudinal direction of the driving axis when the driving axis rotates clockwise or counterclockwise. At least two different apertures(25a,25b,25c) are included in parallel with each other in an aperture install plate(24). The aperture install plate moves in combination with the transfer member, fixed to the transfer member to align the apertures in the lengthwise direction of the driving axis. A control part controls the operation of the driving unit according to manipulation of an operator, electrically connected to the driving unit and a manipulation plate. The aperture changing apparatus is installed in a manner that the apertures can be disposed in the output path of a laser. |
