| 摘要 |
PROBLEM TO BE SOLVED: To provide a multi-chip mounting method that can be adapted to many kinds of chip sizes, has a small influence of heat in connection, and removes remaining adhesives easily, and to provide a curing film-like adhesive used for the multi-chip mounting method. SOLUTION: The multi-chip mounting method includes a process 1 for preparing a plurality of rows of curing film-like adhesives having maximum tape widths in a plurality of groups of chips connected in the same direction on a substrate; a process 2 for tentatively connecting the plurality of rows of film-like adhesives to a row where groups of chips are mounted on the substrate at an active temperature or lower for formation by separating by the maximum tape widths of the plurality of groups of chips connected in the same direction on the substrate; a process 3 for aligning the electrode of the chip connected to an electrode of the substrate having the adhesive in the process 2; and a process 4 for heating and pressurizing the electrode of the chip where the alignment of the electrode is completed, and the electrode on the substrate between the electrodes connected at the active temperature or higher to obtain the electric connection of the plurality of rows of chips on the same substrate. COPYRIGHT: (C)2007,JPO&INPIT
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