| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition for sealing exhibiting good mold-releasability from a mold for molding to enable successive molding without obstacle; and to provide a semiconductor device sealed with such the resin composition for the sealing. SOLUTION: The resin composition for the sealing comprises (A) an epoxy resin, (B) a phenol resin-based curing agent, (C) an inorganic filler and (D) a silicone, satisfying the relation of (θ<SB>0</SB>-θ<SB>100</SB>)/θ<SB>0</SB>≤0.1 (wherein,θ<SB>100</SB>is a contact angle of water on the metal plate surface obtained by repeating 100 times of processes comprising subjecting the resin composition for the sealing to transfer molding on a metal plate under a condition of 175°C and 2 min, and pealing the resultant molded product therefrom; andθ<SB>0</SB>is a contact angle of the water on the metal plate before the transfer molding). The semiconductor device is obtained by sealing a semiconductor element with the cured product of the resin composition. COPYRIGHT: (C)2007,JPO&INPIT
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