发明名称 |
Compliant probes and test methodology for fine pitch wafer level devices and interconnects |
摘要 |
A compliant interposer sheet probe card and a method for testing a wafer or a wafer level package using the probe card are described. Test electronic circuits are connected on one side of a multi-layer substrate. A top side of a compliant interposer sheet is connected to an opposite side of the multi-layer substrate. A wafer or a wafer level package to be tested is contacted with pins on a bottom side of the compliant interposer sheet whereby the wafer or wafer level package can be tested.
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申请公布号 |
US2007040565(A1) |
申请公布日期 |
2007.02.22 |
申请号 |
US20050207336 |
申请日期 |
2005.08.19 |
申请人 |
GEORGIA TECH RESEARCH COPORATION |
发明人 |
JAYABALAN JAYASANKER;ROTARU MIHAI D.;IYER MAHADEVAN K.;ONG ANDREW T.A. |
分类号 |
G01R31/26 |
主分类号 |
G01R31/26 |
代理机构 |
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代理人 |
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地址 |
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