| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To form a via hole which is excellent in shape and reliability by finding laser processing conditions suitable for manufacturing a rigid flex multilayer substrate or a multilayer flexible wiring board. <P>SOLUTION: In the manufacturing method of a rigid flex multilayer substrate or a multilayer flexible wiring board, laser processing conditions for forming a via hole 32 used for interlaminar connection are prepared such that pulse energy is 1 to 20 mJ, a pulse width is 1 to 30μs and the number of shots is 1 to 10. In the method, it is preferable to form a multilayer plate 30 by laminating a plurality of copper clad plates 10, 20, and to form an opening 23 for the via hole 32 by carrying out laser processing in the sate of the multilayer plate 30. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
