| 摘要 |
PROBLEM TO BE SOLVED: To provide an electric testing method which is excellent in electric connection reliability. SOLUTION: The electric testing method enables the tests of a semiconductor device comprising a semiconductor substrate having an electrode pad and a passivation membrane, a resin projection formed upward on the semiconductor substrate, and a conductive layer which is formed such that it is electrically connected to the electrode pad, and it passes above the resin projection from a region above the electrode pad, and its head section reaches a region above the passivation membrane. In the electric testing method, a test terminal is brought to contact with the side of the resin projection on the head section side of the conductive layer through the conductive layer. COPYRIGHT: (C)2007,JPO&INPIT
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