发明名称 APPARATUS FOR CHAMFERING WAFER, GRINDING WHEEL THEREFOR AND TRUING GRINDING WHEEL
摘要 PROBLEM TO BE SOLVED: To provide an apparatus for chamfering a wafer, which apparatus can simplify its mechanism, and also can carry out very precise and stable chamfering work. SOLUTION: In the chamfering apparatus 10 for machining the outer peripheral portion of the wafer W mounted on a rotating wafer table 34 into a required shape by a rotating grinding wheel, the mechanism of the chamfering apparatus 10 can be simplified, and also the precise and stable chamfering work can be carried out by means of a combined grinding wheel 80 integrally formed of rough grinding wheels 51, 90, 91, 92 for rough-grinding the wafer W and truing grinding wheels 52, 85, 86, 87. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007044817(A) 申请公布日期 2007.02.22
申请号 JP20050232221 申请日期 2005.08.10
申请人 TOKYO SEIMITSU CO LTD;TOSEI ENGINEERING:KK 发明人 KATAYAMA ICHIRO
分类号 B24B9/00;B24B53/07;H01L21/304 主分类号 B24B9/00
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