| 发明名称 |
Molecular caulk: a pore sealant for ultra-low k dielectrics |
| 摘要 |
Methods of use of parylene based polymers with porous ultra-low kappa dielectric materials and use of parylene barriers in integrated circuit fabrication are presented.
|
| 申请公布号 |
US2007042609(A1) |
申请公布日期 |
2007.02.22 |
| 申请号 |
US20060413527 |
申请日期 |
2006.04.28 |
| 申请人 |
SENKEVICH JOHN J;LU TOH-MING |
发明人 |
SENKEVICH JOHN J.;LU TOH-MING |
| 分类号 |
H01L21/31;H01L21/4763 |
主分类号 |
H01L21/31 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
