发明名称 ELECTROFORMING MOLD AND METHOD FOR MANUFACTURING THE SAME, AND METHOD FOR MANUFACTURING ELECTROFORMED COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide an electroforming mold for manufacturing a multi-step structure minute component and a method for manufacturing the same, for which height control is possible and manufacturing process does not become complicated. SOLUTION: On the upper face of a film of an electroconductive layer 2 formed on the upper face of a substrate 1, a resist 3 is formed on the upper face of the electroconductive layer 2 in which a first soluble portion 3b and a first insoluble portion 3a are formed. Next, a light-absorbing body 10 is formed on the upper face of the resist, exposure and development are carried out, in addition a film of an electroconductive layer 2 is formed on the upper face thereof, and a light-absorbing body 10 and an electroconductive layer 5 on the upper face of the light-absorbing body 10 are removed by liftoff. Further, a resist is formed on the upper face thereof, in which a second soluble portion 6b and a second insoluble portion 6a are formed. Next, the first resist and the second resist are developed to remove the first soluble portion 3b and the second soluble portion 6b, thereby giving an electroforming mold 101 having an electroconductive layer on the basal part of respective steps. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007046147(A) 申请公布日期 2007.02.22
申请号 JP20050335328 申请日期 2005.11.21
申请人 SEIKO INSTRUMENTS INC 发明人 NIWA TAKASHI;ICHIHARA SUSUMU;SHIGEJIYOU KOUICHIROU;HOSHINA HIROYUKI
分类号 C25D1/10;B82B1/00;B82B3/00;G03F7/26 主分类号 C25D1/10
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