| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor substrate which provides all processing histories, wafer ID, chip ID, product number, etc. in the manufacturing process of a semiconductor wafer and a semiconductor. SOLUTION: Dot marks having mark central portions raising from a marked surface, and maximum length along the marked surface of the raised portions is 1-15μm and its height is 0.01-5μm, on a cutting plane or grinding plane of a semiconductor wafer (W) whose surface roughness of the marked surface is 0.3μm or less. The dot marks are excellent in visibility in spite of being microscopic. COPYRIGHT: (C)2007,JPO&INPIT
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