发明名称 SOLDERING FLUX
摘要 PROBLEM TO BE SOLVED: To provide a solder paste which is preserved for a long period of time at normal temperature, and excellent in printability of fine patterns of a high-density circuit by using a flux having excellent wettability and lead-free solder powder. SOLUTION: At least a part of an activator in a flux is used in a coated particle manner where the activator is coated with a thermoplastic substance. The coated particles of the activator are preferably small particles in a nearly mono-dispersed state of the integrated volume grain size distribution in which the average grain size is in a range of 0.1-10μm, the 10% diameter is≥1/2 of the 50% diameter, and the 90% diameter is≤1.5 times the 50% diameter by passing an emulsion of the activator through a porous film (ex. a porous glass film). COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007044733(A) 申请公布日期 2007.02.22
申请号 JP20050232078 申请日期 2005.08.10
申请人 MIYAZAKI PREFECTURE;SENJU METAL IND CO LTD 发明人 TORIGOE KIYOSHI;SHIMIZU MASATAKA;YAMAMOTO KENJI;MIZOZOE MITSUHIRO;TAKAHASHI HOUSHIROU;SUZUKI TOMOHIDE;HORI TATSUYA;MURASE MOTOYASU
分类号 B23K35/363;B23K35/22;B23K35/26;C22C12/00;C22C13/00;C22C13/02;C22C28/00;H05K3/34 主分类号 B23K35/363
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