| 摘要 |
PROBLEM TO BE SOLVED: To increase a cleaning effect in a washing section which removes particles such as polishing waste sticking to the front/rear faces of a substrate after processing such as CMP treatments. SOLUTION: A substrate processing device 100 is a device that performs washing processing on a wafer W, and sequentially transports the wafers W which undergoes CMP treatments by a CMP device 200 to a plurality of processing sections 30, 40, 50 for washing them. The wafer W is held at a holding roller 80 (a to c) of holding hands 35a, 35b in the processing section 30. A peripheral edge washing means 90 is disposed at a washing position under by an elevating drive means 94. The front/rear faces of the wafer W rotated by the rotation of the roller 80 (a to c) are washed by a double-face washing device 34, and the peripheral edge is simultaneously pressed against a side of a brush bristle 922 in a peripheral edge washing means 90 and its lower face and end face are washed. COPYRIGHT: (C)2007,JPO&INPIT
|
