| 摘要 |
An image pickup module with an image sensor packaged by way of flip chip, including: a base seat formed with a cavity and having a lead frame embedded in the base seat, the lead frame having multiple outer leads for connecting with a circuit board and multiple inner leads extending from the outer leads into the cavity of the base seat; an image sensor inlaid in the cavity of the base seat, the image sensor being composed of a glass substrate and an image sensing chip bonded with a surface of the glass substrate by way of flip chip, multiple circuits being laid on the surface of the glass substrate for electrically connecting with the image sensing chip and the inner leads; and a soft pad abutting against lower sides of the inner leads.
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