| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device wherein a heat spreader is fastened to a semiconductor chip by solder and cracks are prevented from appearing from the upper corners of the ends of a polyimide film covering gate liners to the inside of the solder. <P>SOLUTION: An oxide film 2 is formed on a semiconductor substrate 1, and a polysilicon interconnection 3 connected to a gate electrode of IGBT of polysilicon is formed on top of the oxide film 2. Then, an insulation film 4 is formed and openings 5 are formed therein. The gate liners 6 and 7 and the polysilicon interconnection 3 are connected via the openings 5. The emitter region of the IGBT and a plurality of emitter electrodes 9 are also connected via the openings 5. The gate liners 6 and 7 are covered by polysilicon films 10 and 11. The upper corners of the ends of the polyimide film 10 on the gate liner 6 put between the emitter electrodes 9 are rounded to reduce stress applied on the corners in a repetitious cooling and heating environment. Consequently, cracks can be prevented from appearing in the solder 13 for fastening the heat spreader 12 to the emitter electrodes 9. <P>COPYRIGHT: (C)2007,JPO&INPIT |
