| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To prevent damage of an insulating film provided just under a bonding pad, related to a semiconductor device provided with the bonding pad of a two-layer structure comprising a lower wiring and an upper wiring. <P>SOLUTION: The device comprises an insulating film 12 provided to a semiconductor substrate 11, the bonding pad 13 comprising the lower wiring 21 and the upper wiring 22 provided on the insulating film 12, and an insulating film 15 provided between the upper wiring 22 and the insulating film 12. The insulating film 15 is so provided as not to overlap with an upper surface 21A of the lower wiring 21. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
