| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device of higher heat radiation effect from a semiconductor along with its manufacturing method, while assuring connection precision by keeping thermal contraction of an insulating substrate low, with no rising of a cost due to increase in kind of used materials and number of components, nor increase in the number of manufacturing processes. SOLUTION: In a semiconductor device 47, a semiconductor 42 is connected to a conductor pattern 30 formed by a print wiring technology and is flip-chip mounted on the surface of a flexible insulating substrate 26. A through-hole 38 that penetrates front and rear surfaces of the insulating substrate is opened where the semiconductor is mounted. A sealing resin 46 of high heat conductivity that is injected in the through-hole is used to seal the semiconductor. The semiconductor is connected to a heat radiation plate 37 provided to the rear surface of the insulating substrate 26, so that the heat of the semiconductor is transferred to the heat radiation plate and radiated in the air by way of the heat radiation plate. COPYRIGHT: (C)2007,JPO&INPIT |
