发明名称 FIBER-RESIN COMPOSITE, ITS MANUFACTURING METHOD AND PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a fiber-resin composite having a good thickness precision on which fine wiring can be formed, a laminate comprising the composite and an electroless plating laminated on the composite is applied, its manufacturing method, and a printed wiring board made by using the fiber-resin composite. SOLUTION: The fiber-resin composite is made by heat-compressing a sheet composed of a resin composition containing a thermoplastic resin, particularly a sheet containing a layer of a polyimide resin having a siloxane structure, on a fiber. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007045150(A) 申请公布日期 2007.02.22
申请号 JP20060194278 申请日期 2006.07.14
申请人 KANEKA CORP 发明人 SHIMOOOSAKO KANJI;ITO TAKU;NISHINAKA MASARU;TANAKA SHIGERU;MURAKAMI MUTSUAKI
分类号 B32B27/12;B32B15/088;B32B27/34;H05K1/03 主分类号 B32B27/12
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