发明名称 Method of manufacturing vertical GaN-based light emitting diode
摘要 The present invention relates to a method of manufacturing a vertical GaN-based LED. The method includes forming an insulating pattern on a substrate to define LED regions having a predetermined size; sequentially stacking an n-type GaN-based semiconductor layer, an active layer, and a p-type GaN-based semiconductor layer on the substrate except for the insulating pattern to form a light emitting structure; removing the insulating pattern to divide the light emitting structure into LED sections having a predetermined size; forming p-electrodes on the LED sections, respectively; forming a structure support layer on the p-electrodes; removing the substrate to expose the divided n-type GaN-based semiconductor layer; and forming n-electrodes on the exposed n-type GaN-based semiconductor layer.
申请公布号 US2007042520(A1) 申请公布日期 2007.02.22
申请号 US20060503944 申请日期 2006.08.15
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 OH JEONG T.;LEE JAE H.;CHOI SEOK B.
分类号 H01L21/00;H01L33/06;H01L33/32 主分类号 H01L21/00
代理机构 代理人
主权项
地址