发明名称 |
Method of manufacturing vertical GaN-based light emitting diode |
摘要 |
The present invention relates to a method of manufacturing a vertical GaN-based LED. The method includes forming an insulating pattern on a substrate to define LED regions having a predetermined size; sequentially stacking an n-type GaN-based semiconductor layer, an active layer, and a p-type GaN-based semiconductor layer on the substrate except for the insulating pattern to form a light emitting structure; removing the insulating pattern to divide the light emitting structure into LED sections having a predetermined size; forming p-electrodes on the LED sections, respectively; forming a structure support layer on the p-electrodes; removing the substrate to expose the divided n-type GaN-based semiconductor layer; and forming n-electrodes on the exposed n-type GaN-based semiconductor layer.
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申请公布号 |
US2007042520(A1) |
申请公布日期 |
2007.02.22 |
申请号 |
US20060503944 |
申请日期 |
2006.08.15 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
OH JEONG T.;LEE JAE H.;CHOI SEOK B. |
分类号 |
H01L21/00;H01L33/06;H01L33/32 |
主分类号 |
H01L21/00 |
代理机构 |
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地址 |
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