发明名称 Wire structure, a method for fabricating a wire, a thin film transistor substrate, and a method for fabricating the thin film transistor substrate
摘要 Provided are a wire structure, a method for fabricating a wire, a thin film transistor (TFT) substrate, and a method for fabricating the TFT substrate. The wire structure includes an underlying layer including a silver oxide formed on a lower structure, and a silver conductive layer including silver or a silver alloy formed on the underlying layer.
申请公布号 US2007040954(A1) 申请公布日期 2007.02.22
申请号 US20060440767 申请日期 2006.05.25
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 LEE JE-HUN;JEONG CHANG-OH;CHO BEOM-SEOK;BAE YANG-HO
分类号 G02F1/136 主分类号 G02F1/136
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