发明名称 |
Wire structure, a method for fabricating a wire, a thin film transistor substrate, and a method for fabricating the thin film transistor substrate |
摘要 |
Provided are a wire structure, a method for fabricating a wire, a thin film transistor (TFT) substrate, and a method for fabricating the TFT substrate. The wire structure includes an underlying layer including a silver oxide formed on a lower structure, and a silver conductive layer including silver or a silver alloy formed on the underlying layer.
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申请公布号 |
US2007040954(A1) |
申请公布日期 |
2007.02.22 |
申请号 |
US20060440767 |
申请日期 |
2006.05.25 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
LEE JE-HUN;JEONG CHANG-OH;CHO BEOM-SEOK;BAE YANG-HO |
分类号 |
G02F1/136 |
主分类号 |
G02F1/136 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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