| 发明名称 |
ISOLATING CHIP-TO-CHIP CONTACT |
| 摘要 |
An apparatus has two slabs of substrate material joined to each other, the two slabs including a pair of contacts joined to each other having a shape separating a first area from a second area. |
| 申请公布号 |
WO2006138457(A3) |
申请公布日期 |
2007.02.22 |
| 申请号 |
WO2006US23297 |
申请日期 |
2006.06.14 |
| 申请人 |
CUBIC WAFER, INC.;TREZZA, JOHN |
发明人 |
TREZZA, JOHN |
| 分类号 |
H01L23/12 |
主分类号 |
H01L23/12 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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