There is provided a means for laminating and bonding a flexible printed circuit and a stiffener film with an adhesive layer therebetween by using a laminator without creating air bubbles at the lamination surface and without using large-scale manufacturing equipment. A method comprising: providing a laminate in which liners are on upper and lower surfaces of a half-cured reactive adhesive layer (3), removing one of the liners from the laminate, and bonding a surface of a first adherend (2) to the first exposed surface of the adhesive layer; removing the other liner from the laminate, pressure bonding a minute embossing pattern (4) surface of an embossed liner to the second exposed surface of the adhesive layer to form a minute embossing pattern on the surface of the adhesive layer; and removing the embossed liner from the surface of the adhesive layer, and thermocompression bonding a second adherend to the surface of the adhesive layer having the minute embossing pattern.
