| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive dry film for efficiently manufacturing a printed wiring board superior in workability, excellent in temporarily fixing property and capable of easily peeling a support film from the photosensitive layer. <P>SOLUTION: The photosensitive composition for the dry film consists of (A) a photo curable resin having a carboxyl group obtained by reacting a reaction product of (a) a bisphenol epoxy resin denoted by general formula (1) (symbols in the formula are described in the specification) and (b) an unsaturated group contained monocarboxylic acid with (c) polybasic acid anhydride, (B) a photopolymerization initiator, and (C) an epoxy resin, and uses (a-1) a substance having a ratio of 10-84 mol% of a 2,3-epoxypropyl group in an epoxy resin being 2,3-epoxy propyl group by Y and (a-2) another substance exceeding 84 mol% in general formula (1) as (a) the bisphenol epoxy resin. The dry film, and the photosensitive dry film using the composition and the printed wiring board using the composition are provided. <P>COPYRIGHT: (C)2007,JPO&INPIT |
