| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To solve the problem that the entire ceramic substrate of a conventional compound ceramic substrate warps accompanying the warp of the mother substrate, and therefore in the case of a ceramic substrate on which components to be mounted, such as passive components and active components, are mounted, the mounted components cannot follow the warp of the ceramic substrate, and there is the possibility that the terminal for external connection of the surface-mounted components is dislocated from the electrode of the ceramic substrate and broken. <P>SOLUTION: A compound ceramic substrate 10 comprises a ceramic substrate 12 on the undersurface of which surface-mounted components 11B are mounted, an external terminal electrode 14 for connecting a wiring pattern 13 formed on the ceramic substrate 12 and the surface electrode of the mother substrate, a projection leg 15 made of resin provided on the undersurface of the ceramic substrate 12 and supporting the external terminal electrode 14 at its end face, a via hole conductive body 15B provided within the leg 15 and connecting the external terminal electrode 14 and the wiring pattern 13, and a compound resin layer 18 for coating the surface-mounted components 11B. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
