| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a hybrid multilayered circuit substrate that forms a shield layer resistant to EMI without scrape, by printing a conductive paint on a region spreading over a stepped portion between a part mounted section and a flexible circuit board in a screen-printing method. <P>SOLUTION: The method for manufacturing the hybrid multilayered circuit board forms the shield layer resistant to electromagnetic interference (EMI), by printing the conductive paint on the region spreading over the stepped portion between the part mounted section and the flexible circuit board. The cross-section shape of the stepped portion is like stairs of 2 steps or more, the height of a step of each stair step is within 100μm, each length of the stair steps is the same as in the step or more in dimensions, a step is formed having a shape of a crossing angle of the line connecting the farthermost end of the part mounted section to the peak of the mostly protruded stair step and the flexible circuit substrate of less than 50°. The conductive paint is continuously printed on the stepped portion in the screen-printing method. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
