发明名称 |
LED package and fabrication method thereof |
摘要 |
An LED package and a fabrication method thereof are provided. The LED package includes an upper metal plate having an LED-receiving hole therein; a lower metal plate disposed under the upper metal plate; and an insulator which the upper metal plate and the lower metal plate from each other. A portion of the lower metal plate is exposed via the LED-receiving hole and an LED is mounted on the exposed portion of the lower metal plate and is electrically connected to both of the upper and lower metal plates. A protective cover encloses and protects exposed surfaces of the upper and lower metal plates.
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申请公布号 |
US2007039164(A1) |
申请公布日期 |
2007.02.22 |
申请号 |
US20060416107 |
申请日期 |
2006.05.03 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KWON KI-HWAN;SHIN KYU-HO;KWEON SOON-CHEOL;MOON CHANG-YOUL;DARBINIAN ARTHUR;CHOI SEUNG-TAE;SHIN SU-HO |
分类号 |
H01L33/44;H01S4/00;H01L33/56;H01L33/58;H01L33/62;H01L33/64 |
主分类号 |
H01L33/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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