发明名称 Component mounting circuit board with resin-molded section covering circuit pattern and inner components
摘要 A component mounting circuit board includes a circuit pattern (80) including a plurality of electrically conductive plates (3, 4, 5, 15, 16, 17, 29, 30, 33, 34, 38, 39), an inner electrical component (49, 50, 51, 52, 59, 60, 61, 62) electrically connected to the circuit pattern (80), and a resin molded section (2) made of a resin by way of molding so as to cover the circuit pattern (80) and the inner electrical component (49, 50, 51, 52, 59, 60, 61, 62). The resin molded section (2) has an opening (9, 10, 11) allowing an outer electrical component (46, 47, 54, 56, 63, 65) located outside the resin molded section (2) to be connected to the circuit pattern (80) through it. <IMAGE>
申请公布号 EP1081992(B1) 申请公布日期 2007.02.21
申请号 EP20000307493 申请日期 2000.08.31
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 NAKAGAWA, TATSUYA
分类号 H05K3/28;H05K5/00;H01L23/31;H05B6/64;H05B6/66;H05K1/00;H05K1/02;H05K1/18;H05K3/20;H05K3/34;H05K7/14 主分类号 H05K3/28
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