| 摘要 |
<p>The invention relates to a cooling system for cooling electronic devices (102). The cooling system is provided with first cooling means (2,100) for cooling a first cooling medium (100) present in the device, and is also provided with second cooling means (110,111) for cooling a second cooling medium present in the first cooling means, this second cooling means comprising a conduit system which can be arranged in the ground, transport means for the second cooling medium (110,111) in the conduit system and connecting means for connecting to the first cooling means.</p> |
