| 摘要 |
This invention provides a target assembly which is made by jointing a target with a backing plate through a bonding material, but makes the jointed surface between the target and the backing plate not to be exposed to plasma when the target assembly is sputtered, and consequently prevents overdischarge from occurring while the target assembly is sputtered. This target assembly makes an area of the jointed surface between the targets 31a to 31f to be sputtered having a predetermined shape and the backing plates 32a to 32f smaller than the maximum cross sectional area of the target. |
