发明名称 |
Copper base for electronic component, electronic component, and process for producing copper base for electronic component |
摘要 |
<p>A copper base for an electronic component includes a silicon oxide thin film containing at least one of a hydrocarbon group and a hydroxy group is used, the silicon oxide thin film being disposed on a surface of the copper base. Furthermore, a silicon-containing reaction gas is decomposed by generating plasma. The resulting decomposition product is brought into contact with the copper base to form a silicon oxide thin film on a surface of the copper base.</p> |
申请公布号 |
EP1755160(A1) |
申请公布日期 |
2007.02.21 |
申请号 |
EP20060118860 |
申请日期 |
2006.08.14 |
申请人 |
KABUSHIKI KAISHA KOBE SEIKO SHO (KOBE STEEL, LTD.) |
发明人 |
HAYASHI KAZUSHI;KUGIMIYA TOSHIHIRO |
分类号 |
H01L23/495;C23C16/40;C23C16/509;H01L23/31 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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