PACKAGING ELECTRODE, PACKAGE, DEVICE AND PROCESS FOR PRODUCING DEVICE

摘要

In the mounting pad provided on an insulating substrate and comprising an electrically conductive pattern electrically joining with an electronic component and/or a bonding wire connected to an electronic component, the electrically conductive pattern comprises a plurality of metalized layers stacked one another. By such structure, it can be prevented that an electrically conductive adhesive for joining electronic components with mounting pads flowing out from the joining section therebetween causes short-circuit of the mounting pads or interferes wire-bonding by covering the bonding area.