发明名称 |
ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL, CONNECTING STRUCTURE FOR CIRCUIT MEMBER, AND SEMICONDUCTOR DEVICE |
摘要 |
The adhesive composition of the invention comprises a thermoplastic resin, a radical polymerizing compound, a radical polymerization initiator and a radical polymerization regulator. According to the present invention it is possible to provide an adhesive composition, a circuit connecting material, a connection structure for a circuit member and a semiconductor device whereby curing treatment can be carried out with sufficient speed at low temperature, curing treatment can be carried out with a wide process margin, and adequately stable adhesive strength can be obtained. |
申请公布号 |
EP1754762(A1) |
申请公布日期 |
2007.02.21 |
申请号 |
EP20050748959 |
申请日期 |
2005.06.08 |
申请人 |
HITACHI CHEMICAL CO., LTD. |
发明人 |
KATOGI, SHIGEKI;SUTOU, HOUKO;IZAWA, HIROYUKI;SHIRASAKA, TOSHIAKI;YUSA, MASAMI;KOBAYASHI, TAKANOBU |
分类号 |
C09J4/00;C09J4/06;C09J201/00;H01B1/22;H01L21/60;H05K3/32 |
主分类号 |
C09J4/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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