METHOD FOR PRINTING VIA POINT OF FLEXIBLE PRINTED CIRCUIT BOARD

摘要

A method for printing via hole of a flexible printed circuit board is provided to prevent defects such as distortion or crack of a via hole after the via hole is dried by selectively printing a photo solder resist in the via hole separately. A via hole printing method of a flexible printed circuit board includes the steps of: a via hole printing step(S310) of printing a photo solder resist in a via hole formed on the flexible printed circuit board; a primary drying step(S320) of drying the flexible printed circuit board passed through the via hole printing step; a board printing step(S330) of printing the photo solder resist on the flexible printed circuit board passed through the primary drying step; and a secondary drying step(S340) of drying the flexible printed circuit board passed through the board printing step.