发明名称 |
Polishing pad, a polishing apparatus, and a process for using the polishing pad |
摘要 |
A polishing pad can include a first layer and a second layer. The first layer can have a first polishing surface and a first opening. The second layer can have an attaching surface and a second opening substantially contiguous with the first opening. The polishing pad can further include a pad window lying within the first opening. The pad window can include a second polishing surface and a gas-permeable material. In one aspect, an apparatus can include an attaching surface of a platen lying adjacent to the attaching surface of the polishing pad. In another aspect, a process for polishing can include changing a temperature of a gas within a spaced-apart region formed between a pad and a platen. The process can also include forming a gas flux across the polishing pad after polishing has started.
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申请公布号 |
US7179151(B1) |
申请公布日期 |
2007.02.20 |
申请号 |
US20060390292 |
申请日期 |
2006.03.27 |
申请人 |
FREESCALE SEMICONDUCTOR, INC. |
发明人 |
BOTTEMA BRIAN E.;ABRAHAM STEPHEN F.;PAMATAT ALEX P. |
分类号 |
B24B1/00 |
主分类号 |
B24B1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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