发明名称 Flat-type capacitor for integrated circuit and method of manufacturing the same
摘要 Embodiments of the invention provide flat-type capacitors that prevent degradation of the dielectric layer, thereby improving the electrical properties of the capacitor. The capacitor includes a lower interconnection formed in a predetermined portion of a semiconductor substrate, a lower electrode formed on the lower interconnection that is electrically coupled to the lower interconnection; a concave dielectric layer formed on the lower electrode; a concave upper electrode formed on the dielectric layer; a first upper interconnection that is electrically coupled to the lower interconnection; and a second upper interconnection that is coupled to the upper electrode. The concave upper electrode is larger than the lower electrode.
申请公布号 US7180117(B2) 申请公布日期 2007.02.20
申请号 US20030676865 申请日期 2003.09.30
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 WON SEOK-JUN
分类号 H01L21/768;H01L27/108;H01L21/02;H01L21/316;H01L21/318;H01L21/822;H01L23/522;H01L27/04 主分类号 H01L21/768
代理机构 代理人
主权项
地址