发明名称 |
Flat-type capacitor for integrated circuit and method of manufacturing the same |
摘要 |
Embodiments of the invention provide flat-type capacitors that prevent degradation of the dielectric layer, thereby improving the electrical properties of the capacitor. The capacitor includes a lower interconnection formed in a predetermined portion of a semiconductor substrate, a lower electrode formed on the lower interconnection that is electrically coupled to the lower interconnection; a concave dielectric layer formed on the lower electrode; a concave upper electrode formed on the dielectric layer; a first upper interconnection that is electrically coupled to the lower interconnection; and a second upper interconnection that is coupled to the upper electrode. The concave upper electrode is larger than the lower electrode.
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申请公布号 |
US7180117(B2) |
申请公布日期 |
2007.02.20 |
申请号 |
US20030676865 |
申请日期 |
2003.09.30 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
WON SEOK-JUN |
分类号 |
H01L21/768;H01L27/108;H01L21/02;H01L21/316;H01L21/318;H01L21/822;H01L23/522;H01L27/04 |
主分类号 |
H01L21/768 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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