发明名称 |
Method for reducing or eliminating semiconductor device wire sweep in a multi-tier bonding device and a device produced by the method |
摘要 |
A method of packaging a multi-tier wire bonded semiconductor device is provided. The method includes applying an insulative material across only a portion of at least two of a plurality of conductors per layer providing interconnection between elements in the multi-tier wire bonded semiconductor device. The method also includes encapsulating the conductors and elements, thereby packaging the semiconductor device.
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申请公布号 |
US7179688(B2) |
申请公布日期 |
2007.02.20 |
申请号 |
US20040004750 |
申请日期 |
2004.12.03 |
申请人 |
KULICKE AND SOFFA INDUSTRIES, INC. |
发明人 |
BATISH RAKESH |
分类号 |
H01L21/48;H01L21/56;H01L23/495;H01L29/40 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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