发明名称 |
Circuit board and its manufacturing method |
摘要 |
A circuit board comprises a base film that is a base layer, a first conductive circuit manufactured by hardening conductive paste material formed in a predetermined shape on the base film, a first insulating layer manufactured by hardening insulating paste material formed on the base film and the first conductive circuit, and a second conductive circuit manufactured by hardening conductive paste material in a predetermined shape on the first insulating layer, wherein an electronic part built-in by the first insulating layer and second insulating layer is connected to the second conductive circuit, and the first conductive circuit is connected to the second conductive circuit through a via hole.
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申请公布号 |
US7180749(B2) |
申请公布日期 |
2007.02.20 |
申请号 |
US20030727650 |
申请日期 |
2003.12.05 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
TSUKAHARA NORIHITO;NISHIKAWA KAZUHIRO |
分类号 |
H05K1/18;H01L21/60;H01L23/12;H01L23/538;H01L25/065;H05K1/09;H05K1/16;H05K3/12;H05K3/46 |
主分类号 |
H05K1/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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