发明名称 Plasma polymerization enhancement of surface of metal for use in refrigerating and air conditioning
摘要 According to the present invention, there is provided a plasma polymerization surface modification of a metal for enhancing its applicability for use in refrigerating and air conditioning such as in constructing heat exchanges, by using a DC discharge plasma, comprising the steps of: (a) positioning an anode electrode which is substantially of metal to be surface-modified and a cathode electrode in a chamber, (b) maintaining a pressure in the chamber at a predetermined vacuum level, (c) blowing a reaction gas composed of an unsaturated aliphatic hydrocarbon monomer gas or fluorine-containing monomer and silicon containing monomer gas at a predetermined pressure and a non-polymerizable gas at a predetermined pressure into the chamber, and (d) applying a voltage to the electrodes in order to obtain a DC discharge, whereby to obtain a plasma consisting of positive and negative ions and radicals generated from the unsaturated aliphatic hydrocarbon monomer gas and the non-polymerizable gas, and then forming a polymer with hydrophilicity or hydrophobicity on the surface of the anode electrode by plasma deposition, and there is also provided a plasma polymerization surface modification of a metal for enhancing its applicability for use in refrigerating and air conditioning such as in constructing heat exchanges, by using an RF plasma.
申请公布号 US7178584(B2) 申请公布日期 2007.02.20
申请号 US20040952904 申请日期 2004.09.30
申请人 LG ELECTRONICS INC. 发明人 KOH SEOK-KEUN;JUNG HYUNG JIN;CHOI WON KOOK;KANG BYUNG HA;KIM KI HWAN;HA SAM CHUL;KIM CHEOL HWAN;CHOI SUNG-CHANG
分类号 C23C16/44;F28F13/18;B05D3/14;B05D5/08;B05D7/24;C08F2/00;C08G83/00;C23C14/12;C23C14/22;C23C16/30;C23C16/50;C23C16/503;C23C16/515;C23C16/56;F25B47/00 主分类号 C23C16/44
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