| 摘要 |
This is a semiconductor apparatus capable of realizing a sharing of parts without introducing enlargement of the apparatus and deterioration in reliability of the wire bonding in case of responding to various electronic circuits. It is a semiconductor laser apparatus configured to include a housing ( 1 ) in which device mounting portions ( 1 A), ( 1 B) are respectively formed on both one surface side and the other surface side thereof; a semiconductor laser device ( 1 ) mounted in the device mounting portion ( 1 A) on one surface side of this housing; a photo-diode ( 11 ) mounted in the device mounting portion ( 1 B) on the other surface side of the housing; and a plurality of leads ( 3 ), ( 4 ), ( 5 ), and ( 6 ) connected through wires ( 8 ) to either the semiconductor laser device ( 7 ) or the photo-diode ( 11 ), wherein the pad portions ( 5 B) of the leads ( 5 ) are exposed to the device mounting portions ( 1 A), ( 1 B) in the position relation alternate with each other on the one surface side and the other surface side of the housing ( 1 ), so that the wire bonding to the pads ( 5 B) of the leads ( 5 ) is properly performed from either one surface side or the other surface side of the housing ( 1 ) by setting this exposed portion as the connection portion of the wire bonding.
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