发明名称 Semiconductor device
摘要 A semiconductor device includes a silicon substrate having a film thickness smaller than a maximum range of a particle generated by a nuclear reaction between a fast neutron and a silicon atom, and a semiconductor element formed on a surface of the silicon substrate.
申请公布号 US7180114(B2) 申请公布日期 2007.02.20
申请号 US20040874306 申请日期 2004.06.24
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 NAKAMURA MITSUTOSHI;AMAKAWA HIROTAKA
分类号 H01L23/50;H01L23/556;H01L21/00;H01L21/02;H01L21/8242;H01L21/8244;H01L23/495;H01L23/552;H01L27/10;H01L27/108;H01L27/11;H01L29/06;H01L31/00 主分类号 H01L23/50
代理机构 代理人
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