发明名称 |
Method of fabricating an electronic device |
摘要 |
A method of fabricating an electronic device includes the following steps: a) providing a substrate; b) forming a first strip on the substrate; c) coating an insulation layer on the first strip and the substrate while completely overlaying the first strip and the substrate with the same; d) forming a second strip on the insulation layer; e) forming conductive polymer on the insulation layer while completely overlaying the second strip with the same; f) etching the conductive polymer via plasma etching for completely removing the conductive polymer on the second strip; and g) forming a semiconductor layer on the second strip and the conductive polymer.
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申请公布号 |
US7179697(B2) |
申请公布日期 |
2007.02.20 |
申请号 |
US20050131387 |
申请日期 |
2005.05.18 |
申请人 |
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE |
发明人 |
HU TARNG-SHIANG;HO JIA-CHONG;HUANG LIANG-YING;LEE CHENG-CHUNG |
分类号 |
H01L21/00;H01L21/84;H01L29/786 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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