发明名称 Method of fabricating an electronic device
摘要 A method of fabricating an electronic device includes the following steps: a) providing a substrate; b) forming a first strip on the substrate; c) coating an insulation layer on the first strip and the substrate while completely overlaying the first strip and the substrate with the same; d) forming a second strip on the insulation layer; e) forming conductive polymer on the insulation layer while completely overlaying the second strip with the same; f) etching the conductive polymer via plasma etching for completely removing the conductive polymer on the second strip; and g) forming a semiconductor layer on the second strip and the conductive polymer.
申请公布号 US7179697(B2) 申请公布日期 2007.02.20
申请号 US20050131387 申请日期 2005.05.18
申请人 INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE 发明人 HU TARNG-SHIANG;HO JIA-CHONG;HUANG LIANG-YING;LEE CHENG-CHUNG
分类号 H01L21/00;H01L21/84;H01L29/786 主分类号 H01L21/00
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