| 摘要 |
It comprises circuit board 10 with circuit pattern 2 formed by conductive resin paste on resin substrate 1 , surface-mounted type electronic components 30, 40 arranged with electrode terminals with respect to the connecting region of circuit pattern 2 , connecting member 3 formed from conductive resin paste for connecting the connecting region to the electrode terminal, and insulating adhesive 6 for bonding the electronic components 30, 40 and circuit board 10 , which is lower in curing temperature than conductive resin paste and disposed in a space between circuit board 10 and electronic components 30, 40 between connecting regions. |
