Fabrication method for stacked multi-chip package

摘要

A stacked multi-chip package includes a substrate, a first chip and a second chip. The first chip is fixed to the substrate, and is provided with a collar portion which opposes an upper face of the substrate in a state such that a gap is formed between the upper face of the substrate and the collar portion. The second chip is disposed in a region below the collar portion. The second chip is fixed to the substrate and does not make contact with the first chip.