发明名称 |
Semiconductor apparatus with multiple delivery devices for components |
摘要 |
An apparatus is provided for transferring components from a pick-up position amongst a supply of components to a placement position on a receptor, such as a die pad, during semiconductor processing. It includes a first delivery device and a second delivery device operative to alternatively transfer the components from the pick-up position to the placement position. The second delivery device is arranged opposite the first delivery device about a line passing through the pick-up position and the placement position.
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申请公布号 |
US7179346(B2) |
申请公布日期 |
2007.02.20 |
申请号 |
US20030454259 |
申请日期 |
2003.06.03 |
申请人 |
ASM ASSEMBLY AUTOMATION LTD. |
发明人 |
LAM KUI KAM;NG MAN CHUNG RAYMOND;TANG YEN HSI TERRY |
分类号 |
B32B37/00;H01L21/67;H01L21/00;H01L21/52 |
主分类号 |
B32B37/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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