发明名称 |
Methods of forming capacitors with high dielectric layers and capacitors so formed |
摘要 |
Methods of forming a capacitor of a semiconductor device can include forming a lower electrode of a capacitor on a semiconductor substrate and forming a dielectric material layer of Ba(Ti<SUB>1-x</SUB>Sn<SUB>x</SUB>)O<SUB>3 </SUB>(BTS) or Ba(Ti<SUB>1-x</SUB>Zr<SUB>x</SUB>)O<SUB>3 </SUB>(BTZ) on the lower electrode. An amorphous layer can be formed on the dielectric material layer. An upper electrode of the capacitor can be formed on the amorphous layer.
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申请公布号 |
US7179704(B2) |
申请公布日期 |
2007.02.20 |
申请号 |
US20040002571 |
申请日期 |
2004.12.02 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
LEE SEUNG-HWAN;BYUN JAE-DONG;KIM SUNG-TAE;KIM YOUNG-SUN;LEE DAL-WON;KO SONG-WON |
分类号 |
H01L21/8242;H01L27/108;H01L21/00;H01L21/02;H01L21/314;H01L29/94;H01L31/119 |
主分类号 |
H01L21/8242 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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