发明名称 Methods of forming capacitors with high dielectric layers and capacitors so formed
摘要 Methods of forming a capacitor of a semiconductor device can include forming a lower electrode of a capacitor on a semiconductor substrate and forming a dielectric material layer of Ba(Ti<SUB>1-x</SUB>Sn<SUB>x</SUB>)O<SUB>3 </SUB>(BTS) or Ba(Ti<SUB>1-x</SUB>Zr<SUB>x</SUB>)O<SUB>3 </SUB>(BTZ) on the lower electrode. An amorphous layer can be formed on the dielectric material layer. An upper electrode of the capacitor can be formed on the amorphous layer.
申请公布号 US7179704(B2) 申请公布日期 2007.02.20
申请号 US20040002571 申请日期 2004.12.02
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 LEE SEUNG-HWAN;BYUN JAE-DONG;KIM SUNG-TAE;KIM YOUNG-SUN;LEE DAL-WON;KO SONG-WON
分类号 H01L21/8242;H01L27/108;H01L21/00;H01L21/02;H01L21/314;H01L29/94;H01L31/119 主分类号 H01L21/8242
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