| 摘要 |
Provided is a cleaning solution for electronic parts, which effectively removes fine impurities or organic substances attached to surfaces of electronic parts while inhibiting corrosion of silicon and metals other than silicon. The cleaning solution for electronic parts comprises: a hydroxide compound; water; a water-soluble organic compound; and at least one compound represented by the formula of HO-((EO)x-(PO)y)z-H or the formula of R-[((EO)x-(PO)y)z-H]m, wherein EO represents an oxyethylene group, PO represents an oxypropylene group, each of x and y is an integer satisfying the condition of x/(x+y)=0.05-4, z represents a positive integer, R is a residue formed by excluding a hydrogen atom from the hydroxyl group of an alcohol or hydroxyl-containing amine, or a residue formed by excluding a hydrogen atom from the amino group of an amine, and m is an integer of 1 or more. |
