| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device for which a highly reliable electric characteristic inspection can be executed. <P>SOLUTION: The semiconductor device includes a semiconductor substrate 10 having electrodes 14 and formed with a plurality of resin layers 18 disposed with intervals on a surface where the electrodes 14 are formed; a resin protrusion 20 formed on the surface of the semiconductor substrate 10 where the electrodes 14 are formed, and having a height higher than that of the resin layer 18; and a plurality of wirings 30 led out from each of the electrode 14 and formed so as to get over the resin protrusion 20. Each of the wirings 30 includes a first portion 31 on the electrode 14, which are arranged with the resin protrusion 20 sandwiched; and a second portion 32 on the semiconductor substrate 10. The second portion 32 of each of the wirings 30 is formed so as to overlap each of the resin layers 18. Each of the resin layers 18 has a portion overflown from the second portion 32. <P>COPYRIGHT: (C)2007,JPO&INPIT |
