| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive composition to be used for manufacturing processes of a semiconductors such as an IC, manufacturing a circuit board of a liquid crystal or a thermal head or other photofabrication processes, and to provide a method for forming a pattern using the photosensitive composition, and in particular, to provide a photosensitive composition improved in exposure latitude and PEB (post exposure baking) temperature dependence, and to provide a method for forming a pattern using the photosensitive composition. <P>SOLUTION: The positive resist composition contains (A) a resin the solubility of which with an alkali developing liquid is increased by an effect of an acid, (B) a compound which generates an acid upon irradiation of active rays or radiation, (C) a compound expressed by general formula (C1), and (D) a solvent. The method for forming a pattern is carried out by using the above composition. In general formula (C1), R<SB>1</SB>represents a substituent; and each of R<SB>2</SB>to R<SB>5</SB>independently represents a hydrogen atom or a substituent. <P>COPYRIGHT: (C)2007,JPO&INPIT |
