发明名称 |
DEVICE AND METHOD FOR CORRECTING DEFECT OF PATTERNED SUBSTRATE, AND METHOD FOR MANUFACTURING PATTERNED SUBSTRATE |
摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a defect correction device and a defect correction method capable of reliably correcting defects, and also to provide a method for manufacturing patterned substrate by using the method. <P>SOLUTION: This device for correcting defects on a patterned substrate 6 is provided with: a mask film 5 oppositely disposed on the substrate 6; a laser beam source which emits a laser beam for disposing an opening part on the mask film 5; and a correction means of correcting the defect on the substrate 6 via the opening part disposed on the mask film 5, wherein a correction part corrected by the correction means is pressed by an elastic body 18. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
申请公布号 |
JP2007041480(A) |
申请公布日期 |
2007.02.15 |
申请号 |
JP20050228253 |
申请日期 |
2005.08.05 |
申请人 |
LASERTEC CORP |
发明人 |
ISHIKAWA TAKUJI;SEKI HIROKAZU |
分类号 |
G02B5/20;G03F7/20;G03F7/40;H01L21/027 |
主分类号 |
G02B5/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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